(Annotated Bibliography) - Essay Example

Annotated Bibliography Mishra, Satchidananda, Michael Pecht and Douglas Goodman. "In-situ Sensors for Product Reliability Monitoring." CALCE Electronic Products and Systems Center; **Ridgetop Group, Inc. (2012): 1-10. Print. Mishra, Pecht, and Goodman’s article In-situ Sensors for Product Reliability Monitoring discusses the advantages of prior prediction of reliability of a product in this case semiconductor devices. According to the article, reliability is “the ability of a product to perform as intended (i.e., without failure and within specified performance limits) for a specified time, in its life cycle application environment” (Mishra, Pecht, and Goodman 1).

By this, the authors mean how efficiently a product serves it purpose for the predicted period. The article claims that predicting the reliability of a product earlier is important since it helps in detection of aspects such as possible failure or decrease in life cycle. This is crucial since it ensures that the material selected for manufacture of the product is appropriate reducing inspection as well as impromptu maintenance. When making predictions, it is important to consider the environment to which the product will be exposed.

This is because the lifecycle may change with environment. Mishra, Pecht, and Goodman (1) list the objectives of reliability prediction as reducing output drawbacks, enhancing maintenance, ensuring that the equipment remains effective, increasing profitability and enable designing of future products that are safer and with lesser failures. The article claims that advancement in technology has increased guarantee and liability of product letdown. This has led to increased product reliability. However, the authors argue that increasing function ability of products such as gate oxide might lead to neglect for reliability.

The article posits, “A reliability prediction for a product is dependent on its structural architecture, material properties, fabrication process, and the life cycle environment” (Mishra, Pecht, and Goodman 2). This is because products manufactured from same production line vary in material properties. Variation in material properties during manufacture of semiconductor devices may lead to altered reliability, which affects functioning ability in different environments. For semiconductor devices, the product life cycle is the expected severity and the load conditions such as temperature, pressure, humidity, dust, electromagnetic radiation levels and the environment.

The factors and other like acoustic levels, sand, dust, and loads affect the reliability of semiconductor device. Variations in manufacturing and life cycle environment are a great challenge to reliability. It is thus crucial to find out the impending product failure and operating conditions.When designing semiconductor devices, it is always advisable to evaluate its reliability in terms of degradation. Being able to predict the actual life cycle can help develop measures to mitigate and manage the product.

Product degradation can be either physical or chemical. In case of physical degradation, one can evaluate factors such as cracks defection, or delamination while chemical degradation can be evaluated by examining the resistance level or the change in threshold voltage. When designing semiconductor devices, the monitors and the circuit (pre-calibrated semiconductor cell) are designed in a way that the operational parameters are the same. This ensures that “any parameter that affects the product reliability will also affect the monitor causing its failure.

” This can made possible by ensuring that both circuits are manufactured using same material. While designing semiconductor devices, it is thus appropriate to specify the material properties such as load resistance and current density. Inquiry would be crucial to ensure that the product manufactured is better than previous ones.Works CitedMishra, Satchidananda, Michael Pecht and Douglas Goodman. "In-situ Sensors for Product Reliability Monitoring." CALCE Electronic Products and Systems Center; **Ridgetop Group, Inc. (2012): 1-10. Print.